India officially announced on August 12 local time that it would approve four more semiconductor projects under the framework of the Indian Semiconductor Program (ISM), increasing the total number of ISM projects from 6 to 10, and the four new projects involved an investment of about 46 billion rupees (IT House note: about 3.777 billion yuan at the current exchange rate).
Among these four projects is India’s first commercial compound semiconductor fab in collaboration with SiCSem and UK’s Clas-SiC Wafer. The plant will be built in the Information Valley of Bhubaneswar, the capital of the Indian state of Odisha, to produce silicon carbide (SiC)-based wafers and devices, with an annual production capacity of 60,000 wafers and 96 million devices.
This project will be built by 3D Glass and will introduce glass interposers with passive devices and Si Bridge (Si Bridge) and 3D heterogeneous integration (3DHI) module production capacity, with a target annual output of 69,000 glass substrates, 13,200 3DHI modules, and 50 million assembly units.
In addition, ASIP will set up a semiconductor manufacturing plant in Andhra Pradesh in cooperation with Korean company APACT, and CDIL will expand its discrete semiconductor manufacturing plant in Punjab. The four projects are expected to create a total of 2,034 professional and technical positions.